3D-IC Partitioning
Cross-source consensus on 3D-IC Partitioning from 1 sources and 4 claims.
1 sources · 4 claims
Uses
How it works
Risks & contraindications
Evidence quality
Highlighted claims
- The studied partitioning problem assigns memory blocks across tiers while keeping logic cells on the bottom tier. — A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models
- Partitioning gate-level netlists across tiers is difficult because final PPA is unknown before backend implementation. — A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models
- The experiments are limited to the Open3DBench memory-on-logic scenario and its eight designs. — A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models
- 3D integrated circuits use vertical die stacking and dense interconnects to improve integration density and potentially shorten important connections. — A PPA-Driven 3D-IC Partitioning Selection Framework with Surrogate Models